Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - Xing-Chang Wei - Books - Taylor & Francis Ltd - 9780367573669 - June 30, 2020
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Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging 1st edition

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power

322 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 30, 2020
ISBN13 9780367573669
Publishers Taylor & Francis Ltd
Pages 322
Dimensions 150 × 220 × 10 mm   ·   453 g
Language English  

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