TSV 3D RF Integration: High Resistivity Si Interposer Technology - Ma, Shenglin (Associate Professor, Department of Mechanical and Electrical Engineering, Xiamen University, China) - Books - Elsevier - Health Sciences Division - 9780323996020 - April 27, 2022
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Ma, Shenglin (Associate Professor, Department of Mechanical and Electrical Engineering, Xiamen University, China)
TSV 3D RF Integration: High Resistivity Si Interposer Technology

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260 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released April 27, 2022
ISBN13 9780323996020
Publishers Elsevier - Health Sciences Division
Pages 292
Dimensions 150 × 220 × 10 mm   ·   503 g
Language English  

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