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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) 2nd edition
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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications
Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)
498 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 11, 2018 |
| ISBN13 | 9780128119785 |
| Publishers | William Andrew Publishing |
| Pages | 508 |
| Dimensions | 151 × 229 × 24 mm · 675 g |
| Language | English |
| Series Editor | Licari, James J. (AvanTeco, Whittier, CA, USA) |
