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3D IC Stacking Technology Banqiu Wu Ed edition
3D IC Stacking Technology
Banqiu Wu
The latest advances in three-dimensional integrated circuit stacking technology
544 pages, illustrations
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | September 16, 2011 |
| ISBN13 | 9780071741958 |
| Publishers | McGraw-Hill Education - Europe |
| Pages | 544 |
| Dimensions | 237 × 159 × 36 mm · 936 g |
| Language | English |